FOPLP (Fan Out Panel-Level Packaging) business provides customers with cost-effective system integration packaging and testing services. ESWIN integrates mature semiconductor packaging and high-precision large-panel technologies, characterized by Fan Out, high density & high bandwidth SiP (System in Package) and panel-level technology platform, thus improving the integration of semiconductor devices and shrinking the product size and improving performance. The FOPLP platform is applicable to a variety of products, including single chip package, multi-chip package, heterogeneous chip integration and SiP. It is widely used in mobile devices, 5G, IoT, AI, high-speed computing, auto field etc.