ESWIN closes Series A funding led by IDG

In January 31st, 2019, Beijing ESWIN Technology Co., Ltd. closed Series A financing, led by IDG Capital, Beijing Singularity Power Investment Fund, Triniti Capital, and Broad Vision Funds participated as well. The funds raised will be used to bolster the growth of ESWIN’s core businesses including IC and Solutions, Silicon Materials, and Advanced Packaging & Testing.

The semiconductor industry is a veritable strategic industry that is closely tied to national economic and social development. In the era of AIoT, new technologies such as 5G, AI, big data, and cloud computing are racing ahead, and emerging application scenarios such as auto, household, and healthcare are burgeoning. As a result, demand for semiconductor chips sees explosive growth. “This presents golden opportunities for our rapid development. We will advance innovation in technologies and products to create greater value for our customers and investors,” said Mi Peng, Head of the Finance Dept. at ESWIN.

According to Yu Xinhua, partner of IDG Capital, “the semiconductor industry is technology-intensive, capital-intensive, and talent-intensive. We know full well the growth cycle of high-tech companies, and we are convinced and optimistic about the long-term value of ESWIN.”

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