About Eswin About Eswin
Our Vision:To be a great respectable company
Our Basic Operating & Management Philosophy

Integrity

Legality

Transparency

Responsibility

Our Core Values

Customer-centric

Technology-based

Quality-oriented

Outcome-driven

Take strivers as the foundation

Pursue excellence with self-reflection

Company Profile

Beijing ESWIN Technology Group Co. Ltd., is a semiconductor products and services supplier, with its core businesses in IC and Solutions, Silicon Materials, Advanced Packaging and Testing.


IC and Solutions Business focuses on mobile devices, smart homes, smart transportation, industrial IoT and other application scenarios, providing customers with IC and solutions in four categories, i.e. display & video, smart connectivity, AIoT and smart processing acceleration.


Silicon Materials Business mainly provides 12-inch monocrystalline silicon polished wafers and epitaxial wafers adopting world-leading processes.


Advanced Packaging & Testing Business includes rear-end IC packaging and testing, COF tape and panel-level packaging and testing.


ESWIN Group boasts an R&D and management team who have rich experiences in global semiconductor field. With its headquarters located in Beijing, ESWIN has R&D centers in Beijing, Haining, Hefei, Chengdu, Xi’an, Southampton in the UK, Seoul in South Korea, and has manufacturing bases in Xi’an, Chengdu, Hefei and Suzhou. Marketing and sales branches have been set up in Hongkong, Guangzhou, Shenzhen, Nanjing, Shanghai, Chinese Taiwan,Silicon Valley in US and Seoul in South Korea.

Chairman's Speech

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Wang Dongsheng was born in Dongyang, Zhejiang Province, China. He has a Master’s degree in Engineering. He is a financial expert and a specialist in systems engineering and semiconductor industry. 


He founded BOE in 1993 and under his outstanding leadership, BOE has grown to be a leading company in global display industry. He put forward the “Survival Law” for the display industry, which was also named “Wang’s Law” by the industry. He also proposed the concept of “semiconductor display”, clarifying the definitions for various new display technologies in the industry. Under his leadership, BOE has reshaped Chinese semiconductor display industry, thus solved the country’s lack in display panels, as Chinese Mainland has long been beset by the scarcity of ICs and display panels. He has been hailed as “Father of China’s Semiconductor Display Industry”. 


In June 2019, Wang Dongsheng stepped down as BOE Chairman and joined Beijing ESWIN Technology Co., starting his new career in the IC industry. In February 2020, Beijing ESWIN Technology Group was reorganized and founded. Wang Dongsheng was elected Chairman.


As a leading innovator and entrepreneur in China’s ICT industry, Wang Dongsheng has been rewarded with many prizes including “David Sarnoff Industrial Achievement” awarded by the Society for Information Display, “Leading Figure of Chinese Information Industry”, etc.

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As a veteran in the ICT industry, I have always dreamed that I could make some contributions to solving the problem of “lacking ICs and display panels” in Chinese Mainland. In addition, some friends said, “You have solved the problem of “display panels”, why not do something in the IC field!” In July 2019, I handed over BOE to the younger generation and started my new career in the IC industry.


“ESWIN” means “E-solution to win”. We focus on three core businesses, i.e. IC and Solutions, Silicon Materials and Advanced Packaging and Testing. Our vision is to be a great respectable company in the above fields globally.


ESWIN boasts a global top-class technology and management team, and we have clear strategies and strong executive capability. Being customer-centric and technology-based, we persist in innovating technologies and products, providing globally competitive products and services to help our customers to succeed. We are willing to cooperate with industry partners to share the new opportunities brought by the AIoT era!


Chairman
Course of Development
2016.03
Beijing ESWIN Technology Co., Ltd. was founded.
2017.10
The AMOLED panel adopting ESWIN’s first AMOLED driver IC was lit up; ESWIN started its display IC business.
2018.03
ESWIN started its smart processing acceleration IC business after acquiring Beijing Panyi Technology Co., Ltd.
2018.04
COF tape production line started construction in Hefei.
2018.05
12-inch silicon wafer production line started construction in Xi’an.
2018.07
ESWIN started its smart connectivity IC business after acquiring Guangzhou Quanshengwei Information Technology Co., Ltd.
2018.08
ESWIN started its IC packaging & testing business after acquiring Chipmore Technology Corporation Limited.
2019.07
ESWIN established the AIoT IC Business Unit and started its TV SoC business. The first silicon ingot was pulled out in the 12-inch wafer production line in Xi’an.
2019.12
The new wafer-level IC packaging production line in Suzhou started mass production. The COF tape production line in Hefei was put into mass production.
2020.02
Beijing ESWIN Technology Group Co., Ltd. was reorganized and founded.
Display & Video Solutions Smart Connectivity Solutions Smart Processing Acceleration Solutions AIoT Solutions
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